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Lead Closed
This opportunity is no longer accepting submissions.
2026 Chip Seal Materials
BID #: N/A
DUE: 4/21/2026
VALUE: TBD
100
Rating
Risk Rank
Green Risk
AI-Powered Lead Insights
Executive Summary
Kingwood Township is soliciting bids for 2026 Chip Seal Materials. The project requires the furnishing, delivery, and supply of emulsified asphalt (CRS-2P, approximately 41,400 gallons) and 3/8” (#8) clean crushed stone (no limestone, approximately 1,200 tons). Bid documents, available electronically at no cost, can be obtained by contacting Irene Battaglia at ibattaglia@vancleefengineering.com. UNLOCK Bids must be submitted on standard proposal forms, enclosed in sealed envelopes clearly marked with the bidder's information, project name, and date. All bids are due by Tuesday, April 21, 2026, at 11:00 AM prevailing time, at the Kingwood Township Municipal Offices. The Township reserves the right to hold bids for up to 60 days before award and to reject any or all bids.
Detailed Risk Breakdown
local preference
No Flags Found
performance bond
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liquidated damages
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Quick Actions
Contacts
Irene Battaglia
hidden@email.com
UnlockJeffrey Jotz
Township Clerk · Kingwood Township Clerk
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Timeline
First Discovered
May 22, 2026
Last Info Update
May 23, 2026
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