Start your 7-day free trial — unlock full access instantly.
← Back to Search
Lead Closed
This opportunity is no longer accepting submissions.
View Archived Notices
BID #: N/A
DUE: 2/24/2026
VALUE: TBD
100
Rating
Risk Rank
Green Risk
AI-Powered Lead Insights
Executive Summary
The municipality is soliciting bids for the 2026 Chip Seal Contract. Additionally, bids are being accepted for 2026 Maintenance and Repair Materials. The bid opening for the Maintenance and Repair Materials is scheduled for February 24, 2026 at 11:00 AM.
Detailed Risk Breakdown
local preference
No Flags Found
performance bond
No Flags Found
liquidated damages
No Flags Found
Quick Actions
Explore More
Timeline
First Discovered
Apr 2, 2026
Last Info Update
Apr 2, 2026
Start your 7-day free trial
Get instant notifications and full bid analysis. Existing users will be logged in automatically.
Start Free Trial